Boyd Unveils Rack Emulator to Streamline Liquid-Cooled Data Center Deployments
August 27, 2025
Boyd, a leader in chip-to-ambient liquid cooling technologies, has launched a new thermal testing solution
Boyd, a leader in chip-to-ambient liquid cooling technologies, has launched a new thermal testing solution
Vendor-neutral industry leader unveils suite of data center solutions, from installation and integration to operations
Successfully tested NeuCool technology at 4,500W per GPU socket—the highest in the industry for direct-to-chip