Karman Industries Unveils Modular 10MW HPU to Boost AI Data Center Deployment
January 16, 2026
Karman Industries has officially introduced its Heat Processing Unit (HPU), a modular 10MW integrated thermal
Karman Industries has officially introduced its Heat Processing Unit (HPU), a modular 10MW integrated thermal
FS, a leading provider of ICT products and solutions, has introduced its latest 1.6T OSFP
Oracle and AMD announced a major expansion of their long-standing, multi-generation collaboration to help customers
Celestica Inc., a leading provider of design, manufacturing, supply chain, and platform solutions, has launched
MiTAC Computing Technology Corporation, a leading server platform designer and manufacturer and a subsidiary of
Nokia and Nscale announced a partnership to accelerate the build-out of AI infrastructure. Nokia will
Schneider Electric, the leader in the digital transformation of energy management and automation, announced new
The Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announces
STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters STMicroelectronics, a global semiconductor