Broadcom Inc. has expanded its industry-leading 200G/lane DSP PHY portfolio by introducing Sian3 and Sian2M, specifically designed to meet the demanding connectivity needs of AI/ML clusters. These innovations optimize power consumption across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links in 800G and 1.6T optical transceiver applications.

Addressing AI’s Growing Bandwidth Demands

With AI workloads expanding rapidly, the demand for increased bandwidth and interconnect density in AI clusters continues to rise. Optical interconnect power consumption remains a key challenge in scaling AI infrastructure. Broadcom’s new Sian3 and Sian2M DSPs, combined with its comprehensive 200G/lane laser portfolio, significantly improve power efficiency and cost optimization for next-generation AI networks.

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Industry-Leading Power Efficiency and Performance

Sian3, a cutting-edge 3nm 200G/lane PAM4 DSP PHY, achieves the industry’s lowest power consumption for 800G and 1.6T optical transceivers utilizing SMF. By enhancing the capabilities of Broadcom’s Sian2 DSP, Sian3 delivers over a 20% power reduction for both EML- and SiP-based 1.6T modules.

Sian2M, optimized for 800G and 1.6T short-reach MMF links, integrates VCSEL drivers and leverages Broadcom’s proven 200G VCSEL technology. This solution enhances power efficiency and performance for short-reach connectivity within AI clusters. Broadcom has already deployed over 50 million channels of 100G VCSELs in AI networks, reinforcing its leadership in optical interconnects.

With the development of Sian3 and Sian2M, Broadcom provides module developers with a complete ecosystem to accelerate the deployment of 200G optics in AI infrastructure. Broadcom’s 200G EML and PD solutions are already shipping in volume, ensuring the highest quality, reliability, and performance for AI optical interconnects.

Executive Insights on Innovation

“Vijay Janapaty, Vice President and General Manager of the Physical Layer Products Division at Broadcom, emphasized the significance of Broadcom’s Sian family of DSP PHYs, stating, “These innovations form the backbone of low-power, high-bandwidth optical connectivity, which is essential for the growing demands of AI/ML clusters. Our latest 3nm Sian3 chip cuts power consumption by over 20% for 1.6T optical modules, while Sian2M integrates VCSEL drivers and 200G VCSELs, optimizing cost and power efficiency for short-reach links. These innovations enable our customers to scale AI clusters and meet the increasing demands of AI workloads.”

Bob Wheeler, Analyst at Large at LightCounting, highlighted the impact of AI-driven demand on DSP shipments: “According to our report on PAM4 and Coherent DSPs, AI infrastructure development is fueling massive growth in PAM4 DSP adoption. By 2028, 1.6T optical transceivers are projected to generate over $1 billion in PAM4 DSP sales, as 102T switch systems transition to 200G serdes.”

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Key Features of Broadcom’s Next-Gen DSP Solutions

Sian3 DSP

  • 3nm 200G/lane DSP for 800G (sub-13W) and 1.6T (sub-23W) transceivers
  • Options for 1.6T retimer PHY (BCM83628) and 800G gearbox PHY (BCM83820)
  • Supports 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet
  • Multiple FEC options: Bypass, Segmented, and Concatenated FEC
  • IEEE 802.3dj D1.3 compliant
  • Integrated laser drivers for SiP and EML modules
  • Sub-75ns roundtrip latency for AI/ML applications
  • Client-side SERDES for long-reach (LR) applications

Sian2M DSP

  • 5nm 200G/lane DSP for 1.6T SR8 transceivers (sub-25W)
  • 800G retimer PHY (BCM85834) supporting 800G and 1.6T pluggable modules
  • Multiple FEC options: Bypass and Segmented FEC
  • Integrated VCSEL driver

200G/lane Lasers

  • First 200G VCSEL supporting IEEE 802.3dj standards
  • Broadcom VCSEL technology with over 5 trillion field device hours and an ultra-low failure rate (<1 FIT)
  • 200G EML technology is now in full-scale production, with millions of units successfully shipped

Industry Collaboration to Advance AI Infrastructure

Richard Huang, CEO of Eoptolink Technology, emphasized the strategic benefits of Broadcom’s innovations: “As the demand for high-speed, energy-efficient connectivity grows, integrating Broadcom’s Sian3 and Sian2M into our transceivers allows us to deliver market-leading performance with substantial cost and power savings. By combining these advanced DSPs with our engineering expertise, we are driving innovation across the ecosystem and enabling scalable, high-density optical connectivity for next-generation AI infrastructure.”

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FAQs

1. Why is Broadcom’s 200G/lane DSP technology critical for AI infrastructure?

Broadcom’s DSP technology enables AI clusters to scale efficiently by reducing power consumption, optimizing bandwidth, and supporting high-density optical interconnects. These innovations help overcome network bottlenecks, ensuring faster data movement for AI workloads.

2. What makes Sian3 and Sian2M different from previous DSP solutions?

Sian3, built on a 3nm process, reduces power consumption by over 20% compared to previous-generation DSPs. Sian2M integrates VCSEL drivers, making it the most power-efficient solution for short-reach AI connectivity.

3. How does Broadcom’s 200G/lane technology impact data center scalability?

By lowering power consumption and enhancing network efficiency, Broadcom’s 200G/lane solutions enable data centers to scale AI clusters without excessive energy costs. This supports the exponential growth of AI-driven applications.

Broadcom continues to drive innovation in optical networking, ensuring that AI infrastructure meets the evolving demands of high-performance computing and large-scale machine learning models.

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