Expanding the TSLink Portfolio with Low-Power, Low-Latency PCIe 6.0 Re-Drivers for Copper Interconnects in AI and Compute Infrastructure
TeraSignal, a leader in intelligent interconnect technology, will showcase its new PCIe 6.0 Intelligent Re-Driver solutions at DesignCon 2025. Designed to meet the rigorous connectivity demands of AI accelerators, GPUs, and CPUs, these innovative solutions deliver low-power, low-latency performance critical for next-generation AI and compute infrastructure.
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The TS5602 Intelligent Re-Driver, supports 4x64Gb/s PCIe connectivity and is available in a compact 7.25mm x 5.25mm FCLGA package as well as a flip chip bumped die. Key features include:
- Over 50% power reduction compared to DSP-based retimers.
- Low latency through DSP-free architecture.
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- Digital eye monitoring for real-time BER visibility on every link.
- Automatic link training powered by TSLink software for streamlined setup.
- Automatic receiver detection for PCIe use cases.
These Intelligent Re-Drivers are versatile for deployment across server boards, riser cards, active copper cables (PCIe ACC), and active optical cables (PCIe AOC), making them ideal for emerging multi-rack server architectures.
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Source – PR Newswire
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