NovoLINC specializes in developing high-performance thermal interface solutions with superior thermal conductivity, reliability, and scalability, addressing critical thermal management challenges as data-center energy consumption surges.
TDK Corporation announced that subsidiary TDK Ventures, Inc. has invested in thermal interface solution innovator NovoLINC, a Pittsburgh, Pennsylvania-based company that is revolutionizing data center and semiconductor cooling with advanced thermal technology. NovoLINC’s unique approach incorporates a proprietary materials system and nanomechanical design, delivering significantly lower thermal resistance compared to conventional materials. This innovative technology addresses thermal management challenges in data centers for AI applications, where energy demands are doubling and cooling costs represent up to 40% of the total data center energy expenditure.
“Our mission is to enable sustainable technology advancement across various industries. Our products improve field performance and reliability for semiconductors, reducing energy and water consumption in data centers. We are excited to partner with our clients to meet the demands of the next generation computing environment.”
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As data centers shift from air cooling to liquid cooling due to the increased power and heat generated by GPUs and high-density chips, thermal interface between the chip and heat sink has become the critical bottleneck in cooling architecture. Traditional thermal interface solutions struggle to meet the demands of modern computing environments, where transistor sizes are decreasing, chip energy densities are increasing, and complex heterogeneous chiplet designs are emerging. NovoLINC’s technology directly addresses these challenges by offering an innovation with high thermal conductivity and exceptionally low thermal resistance (<1mm²-K/W) with improved reliability through a high-throughput production method that ensures quality at scale.
The NovoLINC team has world class subject matter experts Dr. Sheng Shen and Dr. Rui Cheng from Carnegie Mellon University serving as CSO and CTO, respectively. Cofounder Dr. Ning Li, a serial entrepreneur, brings her 18 years of industrial expertise from Seagate Technology and extensive startup experiences as CEO. The technology has been incubated in the ARPA-E COOLERCHIPS program and is gaining traction in industry, including major semiconductor companies and data center hyperscalers.
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TDK Ventures President Nicolas Sauvage remarked, “NovoLINC is tackling one of the most pressing technical challenges concerning data-center cooling and semiconductor thermal management. As data centers and chip manufacturers transition to liquid cooling, NovoLINC’s thermal interface technology offers the performance and scalability needed to support this industry-wide shift. We’re proud to partner with NovoLINC, whose team brings both the expertise and the innovation necessary to transform thermal management for high-density computing.”
NovoLINC CEO Li commented, “Our mission is to enable sustainable technology advancement across various industries. Our products improve field performance and reliability for semiconductors, reducing energy and water consumption in data centers. We are excited to partner with our clients to meet the demands of the next generation computing environment.”
NovoLINC has had strong financial backing from the industry. M Ventures led the round, with participation from Foothill Ventures and TDK Ventures. In addition, the founders of NovoLINC have received grant funding from U.S. National Science Foundation’s Partnerships for Innovation and ARPA-E’s COOLERCHIPS programs.
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Source – businesswire
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