LITEON Technology is making its debut at the GTC 2025 conference, showcasing solutions specifically designed for the NVIDIA GB200 NVL72 and NVIDIA GB300 NVL72 systems. With integrated power, cabinet, and liquid cooling systems, LITEON provides high power density solutions that align with the NVIDIA Blackwell architecture. These solutions help customers accelerate the integration of next-generation AI server cabinets, creating efficient and energy-saving data centers to meet the growing demands of high-performance computing in the AI era. LITEON is unveiling the following solutions for the first time:

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  • 55 kW rack-mounted power shelf that meets NVIDIA MGX rack specifications
  • 33 kW RU high-efficiency lithium battery backup unit (BBU)
  • cold plate compatible with NVIDIA GB300 NVL72
  • new generation of compact liquid-to-air 140 kW sidecar cooling cabinets
  • 120 kW in-rack CDU compatible with the NVIDIA MGX NVL72 architecture

Additionally, to address the power consumption required by increasing computing density, LITEON is unveiling a next-generation integrated power solution, co-developed with NVIDIA, making its first appearance at the GTC conference.

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“LITEON provides comprehensive integrated power management and liquid cooling solutions that not only enhance data center performance and reliability but also meet the needs of various AI application scenarios,” said Anson Chiu, the president of LITEON Technology.

At the 2025 NVIDIA GTC conference, LITEON Technology, in collaboration with its partners, is showcasing the NVIDIA GB300 NVL72 system. This demonstrates LITEON’s capabilities in customized power cabinets and liquid cooling system design and integration. Leveraging its core technology in advanced power management, innovative mechanic design, and core competitive advantages in hardware and software integration, LITEON aims to deliver the best AI computing experience to meet the high-performance AI computing needs of customers’ data centers.

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Source – PR Newswire

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