Empowering Scalable AI Deployments for Datacenter, Hybrid Cloud, and Edge Environments

Hyve Solutions Corporation, a wholly owned subsidiary of TD SYNNEX Corporation and a leading provider of hyperscale digital infrastructures, announced its participation at GTC 2025, taking place March 17-21 in San Jose, California. Hyve will showcase its latest AI infrastructure portfolio, designed to support scalable AI deployments across datacenter, hybrid cloud, and edge environments.

End-to-End AI Lifecycle Solutions

Hyve Solutions, an Elite OEM Partner in the NVIDIA Partner Network (NPN) will demonstrate its robust suite of AI solutions, emphasizing key capabilities that address the full AI lifecycle:

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  • AI Design & Manufacturing – As a U.S. based fully vertically integrated company, Hyve delivers customized solutions specifically engineered for AI, machine learning (ML), and deep learning (DL) workloads. With in-region manufacturing, including U.S. surface-mount technology (SMT) lines, Hyve ensures high-quality production tailored to meet the performance demands of next-generation AI infrastructure.
  • Scalable Architecture – Hyve’s standardized architecture enables smooth GPU communication across servers and clusters, allowing customers to expand their AI infrastructure without major architectural changes. This design supports quick growth while ensuring operational efficiency.
  • Advanced Testing & Cooling – Hyve is bringing up liquid cooled pods in its Olive Branch, MS, facility in Summer of 2025, offering extensive testing for NVIDIA GPUs. Custom testing solutions can be requested, ensuring optimal performance and reliability for high-density AI deployments.
  • Global Deployment Capabilities –Hyve Leverages an extensive global footprint and deep regional compliance expertise to enable rapid AI datacenter deployment across all major geographies, supporting enterprises in accelerating AI initiatives worldwide.

Showcasing Industry-Leading AI Solutions

Conor Malone, VP of Engineering at Hyve Solutions, will speak during the conference on March 18, starting at 3:20 p.m. PT in the SJCC Hall 3 Theater. His topic will be Building the Next-Gen AI Data Center: From Design to Deployment at Scale. Malone will delve into the convergence of accelerated computing, networking, and cooling technologies that enable modern AI factories.

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He will discuss the requirements for delivering scalable AI solutions, highlighting the complexities of custom design, global deployment infrastructure, and understanding testing frameworks. Particular attention will be paid to liquid cooling integration, GPU validation, and the challenges of scaling AI factories across different geographies.

At the Hyve booth, the company will present its latest product lineup, designed to optimize AI deployment and performance:

  • Next-Generation AI Optimized Rack-Ready Solution – Hyve Orion, featuring the NVIDIA HGX platform, delivers high-performance computing for demanding AI workloads with exceptional scalability in a rack-level, plug-and-play solution. The system features both air and liquid cooling options, with a demo specifically including liquid cooling technology from Vertiv. 
  • Build-to-Order Rack & Roll Networking for Rapid Deployment – Designed for quick deployment, Hyve’s flexible, pre-configured or custom solutions accelerates the time to market for AI initiatives.
  • Custom Network Switches – Engineered to enhance rack-level AI deployment at scale, Hyve’s advanced network switches deliver optimized connectivity and performance. Learn more about Hyve’s Custom Network Switches.

Driving Scalable AI Innovation

“Hyve Solutions is committed to advancing AI infrastructure for hyperscalers, cloud service providers, and high-performance computing segments,” said Steve Ichinaga, President of Hyve Solutions. “Our solutions are designed to support the scalability and efficiency required for next-generation AI deployments, backed by our strategic collaboration with NVIDIA and our robust global manufacturing and deployment capabilities.”

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Source – businesswire

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