Accelsius, a recognized leader in two-phase, direct-to-chip liquid cooling for advanced AI and high-performance computing (HPC), has revealed a major milestone in the global data center market. The company announced that DarkNX, a rapidly expanding digital infrastructure provider, has officially signed an agreement to implement Accelsius’ NeuCool technology across its new 300MW AI data center campus in Ontario, Canada. This deployment is set to become the largest two-phase, direct-to-chip cooling installation ever recorded, marking a significant turning point toward large-scale industry adoption of next-generation cooling systems.
To begin with, the massive project will roll out in phases. The first stage consists of two facilities totaling 65MW, with deployments planned for 2026 and 2027. As the AI ecosystem continues to evolve, these timelines place DarkNX among the earliest adopters of large-scale liquid cooling solutions designed specifically for ultra-dense AI workloads.
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Moreover, DarkNX has incorporated NeuCool as a core component of its holistic thermal strategy for the new campus. The company chose Accelsius’ chip-level cooling solution to work in tandem with high-efficiency chiller systems from Johnson Controls (JCI), which will handle overall facility cooling. By combining these two advanced technologies, DarkNX aims to streamline system design, boost efficiency, and operate with significantly warmer facility water temperatures key advantages that enhance sustainability and reduce long-term operational costs.
Explaining the company’s vision, Isaac Islam, CEO of DarkNX, stated, “Our vision is to build the world’s most advanced AI data centers and to do that, we must build them responsibly and efficiently. Our technology agnostic and efficiency-first approach is why Accelsius’ two-phase, direct-to-chip technology stood out for enabling significantly warmer facility water temperatures, which paired with high-efficiency chiller systems from Johnson Controls, gives us a step-change in performance, sustainability, and total cost of ownership. This is the future of AI data center design, and we’re proud to lead the way.”
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Additionally, this deployment highlights a broader shift within the industry. Organizations are increasingly embracing liquid cooling architectures to support the rapidly rising thermal demands of modern AI clusters. NeuCool uses non-conductive refrigerants and offers exceptional heat-removal capacity directly at the chip, which allows for more free-cooling hours and improved energy efficiency across the facility.
Reflecting on the achievement, Josh Claman, CEO of Accelsius, emphasized, “This milestone represents a defining moment for the evolution of liquid cooling. DarkNX’s 300MW commitment signals a clear shift toward large-scale adoption of two-phase, direct-to-chip cooling. We’re excited to support Isaac and the DarkNX team in demonstrating how next-generation cooling, applied at scale, sets a new standard for AI-era data centers.”
Overall, the DarkNX-Accelsius collaboration not only sets a new industry benchmark but also underscores how next-generation cooling technologies are becoming essential to powering the exponential growth of AI infrastructure worldwide.
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