Credo Technology Group Holding Ltd., a leader in secure, high-speed connectivity solutions, has officially joined the Arm Total Design ecosystem. By integrating into this ecosystem, Credo brings its advanced portfolio of SerDes and mixed-signal DSP IP, including its innovative SerDes chiplets, to a broader community of semiconductor designers. This collaboration enables customers to rapidly develop next-generation silicon solutions tailored for AI, cloud computing, and hyperscale data center applications.
“With AI workloads growing increasingly complex, high-speed connectivity and chiplet innovation are more critical than ever,” said Eddie Ramirez, vice president of go-to-market, Infrastructure Business, Arm. “Credo’s leadership in these areas is a great fit for the Arm Total Design ecosystem and will help our mutual partners accelerate their path toward scalable, efficient AI systems.”
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The Arm Total Design platform facilitates seamless collaboration among Credo’s customers and industry partners, simplifying the creation of custom silicon based on Arm Neoverse Compute Subsystems (CSS). By joining this multivendor, Arm-based chiplet ecosystem, Credo empowers customers to build high-performance, low-power infrastructure optimized for the data centers of the future. Its SerDes IP and chiplets complement Arm Neoverse CSS perfectly, providing the essential high-speed connectivity and processing building blocks needed to bring AI-ready solutions to market faster.
Jeff Twombly, vice president of business development at Credo, emphasized the strategic significance: “Arm Total Design demonstrates Arm’s leadership in addressing the evolving challenges that the industry faces in bringing cutting-edge semiconductor technologies to market quickly. Joining the Arm Total Design ecosystem reinforces our commitment to work together with industry partners to advance the core technologies driving energy-efficient and highly-reliable connectivity for massive, data-intensive AI workloads.”
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Credo’s IP portfolio is designed to combine high performance with energy efficiency, ensuring easy integration into customer-specific ASIC designs. Additionally, its chiplets can be incorporated into Multichip Module System on Chip (MCM SoC) and 2.5D Silicon Interposer designs. The company offers a comprehensive SerDes IP family with signaling speeds ranging from 28G to 224G and reach options that include very short reach plus (VSR), medium reach (MR), long reach (LR), and long reach plus (LR+).
By joining the Arm Total Design ecosystem, Credo strengthens its mission to accelerate the development of innovative, energy-efficient, and reliable connectivity solutions that meet the growing demands of AI and hyperscale computing. This partnership signals a significant step toward faster, more collaborative silicon innovation in the AI era.
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