Boyd, a leader in chip-to-ambient liquid cooling technologies, has launched a new thermal testing solution designed to help data center operators deploy liquid-cooled infrastructures more safely and efficiently. The company introduced the Rack Emulator, a tool that accelerates deployment timelines while ensuring optimal thermal performance, ultimately improving time to market for new AI and high-performance computing infrastructure.
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The Rack Emulator replicates the pressure drop and heat dissipation characteristics of a fully populated rack, allowing Boyd to validate coolant distribution units (CDUs) and facility cooling systems before they connect to live IT equipment. By simulating rack operating conditions, the tool ensures that liquid-cooled data centers start up safely, preventing potential damage to sensitive servers. Additionally, the emulator can test electrical inputs to a rack before installation, reducing deployment risks and increasing operational reliability.
David Huang, Boyd’s President of the Thermal Solutions Division, emphasized the practical benefits of the new tool, stating, “Boyd’s new Rack Emulator will help our end clients reliably and safely validate thermal performance and safeguard their IT equipment. We wanted to make it easy to operate so our customers can efficiently deploy at scale, accelerating their data center builds.”
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Designed for ease of use, the Rack Emulator does not require specialized training, making it suitable for large-scale rollouts in modern data centers. Its compact, rack-sized form factor functions as both a thermal load bank and a simulator, fitting seamlessly into existing data center rows. This design minimizes floor space requirements while simplifying load testing and simulations. Furthermore, the emulator’s portability, ease of storage, and straightforward handling contribute to a lower total cost of ownership for end clients. Boyd has made the Rack Emulator available for pre-order, with shipments expected to begin in September.
Boyd’s liquid cooling solutions, combined with its global service network, offer a modular, easy-to-adopt approach for meeting precise thermal performance specifications. With decades of experience in liquid cooling design and manufacturing, Boyd ensures that its technologies deliver reliable, high-quality performance. This latest innovation underscores the company’s ongoing commitment to enabling safe, efficient, and scalable AI and high-performance computing infrastructure deployment worldwide.
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