As global demand for intelligent, video-centric devices continues to rise across both consumer and industrial sectors, ALi Corporation has entered into a strategic licensing agreement with Ceva, Inc. This forward-looking collaboration integrates Ceva’s advanced NeuPro-Nano and NeuPro-M Neural Processing Units (NPUs) into ALi’s upcoming Video Display Sub-System (VDSS) platform.
By combining ALi’s deep experience in multimedia system-on-chip (SoC) design with Ceva’s state-of-the-art AI processing technology, the partnership sets the stage for high-performance audio, video, vision, and AI-powered applications at the smart edge. These applications include intelligent displays, set-top boxes, and a wide range of visual computing devices that demand low-latency and efficient on-device AI.
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The NeuPro-Nano NPU, engineered for ultra-low power consumption, shines in always-on scenarios such as voice, audio, vision, and sensor-based applications. It natively supports transformer models, which makes it highly efficient in executing small language models (SLMs) and emerging AI workloads directly at the edge. In parallel, the NeuPro-M NPU scales from 4 to 200 TOPS/core, making it suitable for more intensive AI tasks, including Vision Transformers (ViT) and generative AI.
By embedding both NeuPro NPUs into its VDSS platform, ALi will offer ASIC design service clients an advanced AI acceleration framework that is both power-efficient and scalable. This will enable seamless deep learning inference across diverse smart edge device use cases.
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Joseph Lien, CEO of ALi Corporation, expressed his enthusiasm about the partnership, stating, “Our collaboration with Ceva marks a significant step forward in our transition to AI-powered ASIC design. It enhances our product offerings and positions us to better meet the growing demands of our global customer base.”
Moreover, the partnership capitalizes on ALi’s well-established design capabilities and customer network, while leveraging Ceva’s NeuPro Studio AI SDK a robust toolset for AI software development. By joining forces, the two companies want to make developing AI system-on-chips easier and help their partners including ODMs, OEMs, and semiconductor makers bring products to market faster.
Ultimately, this collaboration is set to drive a new wave of innovation in the smart edge market, equipping developers with the tools and platforms they need to create faster, smarter, and more responsive AI-enabled video systems.
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