Airsys Cooling Technologies Inc., a global innovator in mission-critical cooling systems, has introduced PowerOne, a next-generation, high-efficiency cooling architecture designed to meet the surging demand created by AI, hyperscale growth, and high-density compute environments. With data centers facing unprecedented thermal loads, the fully modular PowerOne platform scales seamlessly from 1 MW edge sites to 100+ MW hyperscale deployments, marking a major shift in how modern facilities approach cooling.

As data center energy consumption continues to climb, research from Horizon Grand View Research projects that the North American data center cooling market will reach nearly $15 billion by 2030, with cooling alone consuming up to 60% of total energy in dense environments. As a result, operators are under pressure to improve efficiency without sacrificing performance. PowerOne directly addresses this challenge by optimizing energy usage, reducing operational costs, and supporting sustainability goals across facilities.

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Highlighting this shift, Yunshui Chen, CEO and founder of Airsys, emphasized the need for an entirely new cooling paradigm. “With PowerOne, we’re redefining what a cooling system should do,” Chen said. “These solutions are focused not just on energy efficiency, but on unlocking stranded power and turning it into computing capacity, and ultimately, revenue. It’s time that cooling was tailored for the business, not just the facility.”

Built to support IT loads from 1 MW to over 100 MW, PowerOne removes traditional scaling barriers and delivers a new level of cooling agility for operators confronting extreme power densities. To meet diverse deployment models, PowerOne provides two robust solution sets:

Standard Cooling Stack

A modular, facility-driven foundation tailored for AI, HPC, and enterprise workloads, featuring:

  • CritiCool-X: Magnetic-bearing centrifugal chiller for air/liquid hybrid cooling
  • FluidCool-X: Precision CDU engineered for dense compute
  • MaxAir: High-efficiency fan wall system
  • Optima2 CW: CRAH unit optimized for high-density environments

LiquidRack Solution

A single-phase liquid spray cooling system purpose-built for AI workloads. It enables closed-loop, compressor-less cooling and can be paired with:

  • AdiaCool dry coolers for compressor-less free-cooling
  • CritiCool-X for advanced cooling in more demanding climates

PowerOne also sets new performance benchmarks, achieving 0 WUE, industry-leading PUE, and exceptional Power Compute Effectiveness (PCE). While PUE assesses facility efficiency, PCE measures how much provisioned power becomes usable compute. This combination allows operators to increase compute density, reduce delays, and minimize infrastructure expansion.

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Moreover, PowerOne supports greenfield builds, modernization initiatives, and retrofits across both air and liquid cooling environments. Its modular design enables facilities to scale cooling based on compute growth, reducing stranded capacity and preventing unnecessary overbuilds.

Chen further emphasized Airsys’s mission to enable the next phase of digital infrastructure advancement. “Airsys is transforming the cooling industry by building solutions that sustain the world’s most vital digital infrastructure,” he said. “As demand for AI, connectivity and digital services accelerate, Airsys is forging solutions to ensure that the systems that power modern life remain efficient, resilient, and future-ready.”

Scheduled for broader availability in Q4 2025, PowerOne will launch with a new industry-leading warranty program. Pre-orders are now open through the Airsys website and select global partners.

Introducing Aegis: Liquid Cooling Innovation

Alongside the PowerOne rollout, Airsys unveiled Aegis, a new liquid-cooling engineering division operating as a rapid-innovation hub. Leveraging advanced 3D manufacturing, Aegis will accelerate development of two-phase components such as CDUs, cold plates, and control systems to strengthen the PowerOne ecosystem. This collaborative model enables faster engineering cycles and deeper engagement with OEMs, chipmakers, and hyperscalers.

More details on Aegis solutions are expected soon, reinforcing Airsys’s commitment to driving the future of AI-ready cooling technologies.

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